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Corporate Information |
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| Date: | 11/19/2007 |
| Title: | OAI Visit to Valtronic Technologies (USA) Plant in Solon, Ohio |
| Category: | Spotlight |
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| Description: | 
Dr. Michael L. Heil, Col., USAF (ret) and current President and Chief Executive Officer of the Ohio Aerospace Institute and OAI staff including Mr. Donald W. Majcher, Vice President of Technology & Innovation Partnerships (TIP), Mr. David J. Allen, P.E.
Director, Business Development, Research & Educational Programs, TIP Associates, Carol Cash, Dr. Don Bailey and Monica Dumitriu attended the OAI Site Visit to Valtronic Technologies (USA) at the Solon, Ohio plant tour led by Mr. Donald Styblo, Vice President of Technology. OAI recently welcomed Valtronic Technologies (USA), Inc. to the Industry Membership Program and is helping form new Research & Technology partnerships in the field of miniaturization technologies for aerospace and biotechnology.
Valtronic Technologies is also working with the State of Ohio’s two Wright Centers of Innovation, the Wright Center for Sensor System Engineering at Cleveland State University and IDCAST at the University of Dayton.
Valtronic Technologies partners with companies for the development and production of entire products, ranging from micro-electronics and mechanical parts to complex systems. They are a turn-key manufacturing partner for all types of implantable and non-implantable medical products. Valtronic Technologies (USA), Inc. in Solon, Ohio is an ISO 9001:2000, ISO 13485:2003 and RoHS compliance certified facility with over 75% of their manufacturing dedicated to miniaturized medical devices and advanced sensors. A majority of these devices are utilized for in-vivo and in-vitro human applications.
Valtronic Technologies has more than 25 years of expertise in combining microelectronics with micromechanics. In addition, they are also involved with many opportunities available in advanced miniaturized sensors for aerospace and military applications. Within the last two years, Valtronic Technologies has successfully manufactured the pressure sensors on the Boeing 787 Dreamliner ™ and the Acoustic Array Sensors for the Navy’s SSN-774 Virginia-Class Attack Submarine.
Many design and assembly technologies are utilized by Valtronic Technologies when manufacturing on a miniaturized scale; these include Chip-on-Board, Flip-Chip, Chip-On-Chip, Multi-Chip-Module, MEMS packaging, 3D packaging, Flex Circuit packaging, Flex/Rigid Circuit packaging and Surface Mounted Devices (SMD) as small as 01005 (0.010” x 0.005”) in size. Valtronic Technologies is attracting related projects and customers from all over the world; projects that require the manufacturing of miniaturized medical electronic devices and advanced sensors. Miniaturization is a means for increasing market penetration for many products for several reasons: 1) Ability to meet dimensional or weight requirements, 2) Higher functionality for a given form factor, 3) Reduced power consumption, 4) Improved heat dissipation, 5) Increased circuit speed, 6) Higher interconnect density and 7) Improved RF immunity. Valtronic Technologies is a one stop shop for all electronic miniaturization projects. |
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